CSP产品:板厚(0.15-0.25mm)
装配方式：铝线Bonding
表面处理：沉镍金（金厚：0.05um，镍厚：5um）
阻焊要求：黑油，黑油需塞孔； NPTH不许有残油；不许露铜；
半孔要求：半孔金属无缺损，无偏孔，无残油；
Ultra-thin CSP substrate
CSP products: board thickness (0.15-0.25mm)
Assembly method: Aluminum wire bonding
Surface treatment: Shen nickel gold (gold thickness: 0.05um, nickel thickness: 5um)
Soldering resistance requirements: black oil, black oil needs to be plugged; NPTH is not allowed to have residual oil; copper is not allowed to be exposed;
Semi-hole requirements: The semi-hole metal has no defects, no deviated holes, and no residual oil;
