装配方式：金线封装+SMT焊接
表面处理：沉金（金厚：0.02um，镍厚：4um）
导通孔填充要求：导通孔表面履油平整，无明显凹痕
Ultra-thin silicon wheat MEMS substrate
Assembly method: Gold wire package + SMT welding
Surface treatment: Immersion gold (gold thickness: 0.02um, nickel thickness: 4um)
Via hole filling requirements: the surface of the via hole is smooth, without obvious dents
